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SI Journal Paper: Resonant Test Structures Primer and Signal Integrity Applications

Al Neves, Tim Wang Lee, Wild River Technology

DesignCon2017 Paper: A Practical Method to Model Effective Permittivity and Phase Delay Due to Conductor Surface Roughness

DesignCon2017 Best Paper Award Finalist
Lambert (Bert) Simonovich, Lamsim Enterprises Inc.

DesignCon2017 Tutorial: 32 to 56 Gbps Serial Link Analysis and Optimization Methods for Pathological Channels 

Al Neves, Tim Wang Lee, Wild River Technology
Jack Carrel, Xilinx Inc.
Heidi Barnes, Keysight Technologies

DesignCon2017 Paper: BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?

DesignCon2017 Best Paper Award Winner, Test & Measurement catagory
Vladimir Dmitriev-Zdorov, Mentor Graphics
Cristian Filip, Mentor Graphics
Chuck Ferry, Mentor Graphics
Alfred P. Neves, Wild River Technology


DesignCon2016 Tutorial Slides: A “Material” World, Modeling Dielectrics and Conductors for Interconnects Operating at 10-50 Gbps 

Chudy Nwachukwu, Isola
Yuriy Shlepnev, Simbeor
Scott McMorrow, Teraspeed/Samtec


DesignCon2016 Paper:  Old School RF Structure Meets Modern Signal Integrity: The Beatty Standard

Chun-Ting “Tim” Wang Lee, Wild River Technology, University of Colorado at Boulder 
Alfred P. Neves, Wild River Technology

DesignCon2016 Paper: BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?

Vladimir Dmitriev-Zdorov, Mentor Graphics
Cristian Filip, Mentor Graphics
Chuck Ferry, Mentor Graphics
Alfred P. Neves, Wild River Technology

DesignCon2015 Tutorial: Breaking the 32 Gb/s Barrier: PCB Materials, Simulations, and Measurements

Lee Ritchey, Speeding Edge
Heidi Banes, Keysight Technologies
Chun-Ting “Tim” Wang Lee, Wild River Technology, University of Colorado at Boulder 
Alfred P. Neves, Wild River Technology

The PCB Design Magazine Article: Dielectric and Conductor Roughness Models Identification for Successful PCB and Packaging Interconnect Design up to 50 GHz

Yuriy Shlepnev, Ph.D., Simberian Inc.

DesignCon2014 Presentation: The Role of Improved Measurements and Tools in Assessing Simulation-Measurement Correspondence for 32 Gbps

Bob Buxton, Anritsu Company
Alfred P. Neves, Wild River Technology

DesignCon2014 Paper: Managing S-parameter Data for 10 to 32 Gb/s Time-Domain Simulations

James Bell, Wild River Technology
Bob Buxton, Anritsu Company
Jon Martens, Anritsu Company
Alfred P. Neves, Wild River Technology

DesignCon2014 Paper: Cracking the Code of 32 Gbpsec Differential Vias with Advanced Time Domain Methods

Josiah Bartlett, Tektronix
James Bell, Wild River Technology
Tom Dagostino, Teraspeed Consulting Group
Al Neves, Wild River Technology
Michael Steinberger; SiSoft

DesignCon2013 Tutorial: Methods of Improving 3D EM Model Development and Associated Time/Frequency Domain Measurements

James Bell, Wild River Technology
Al Neves, Wild River Technology
Bob Buxton, Anritsu Company
Jon Martens, Anritsu Company
Josiah Bartlett, Tektronix

DesignCon2012 Paper: Robust Method for Addressing 12 Gbps Interoperability for High-Loss and Crosstalk-Aggressed Channels

James Bell, Wild River Technology
Alan Blankman, LeCroy Corporation
Eric Bogatin, Bogatin Enterprises
Alfred Neves, Wild River Technology
George Noh, Vitesse Semiconductor
Martin Spadaro, Vitesse Semiconductor

DesignCon2011 Paper: Developing Unified Methods of 3D Electromagnetic Extraction, System Level Channel Modeling, and Robust Jitter Decomposition in Crosstalk Stressed 10 Gbpsec Serial Data Systems

James Bell, Wild River Technology
Scott McMorrow, Teraspeed Consulting Group
Martin Miller, LeCroy Corp
Alfred Neves; Wild River Technology

DesignCon2010 Paper: Full-wave time domain modeling of interconnects

Martin Schauer, Computer Simulation Technology
Alfred Neves, Teraspeed Consulting Group
Tom Dagostino, Teraspeed Consulting Group
Scott McMorrow, Teraspeed Consulting Group

DesignCon2010 Paper: Practical identification of dispersive dielectric models with generalized modal S-parameters for analysis of interconnects in 6-100 Gb/s applications

Yuriy Shlepnev, Simberian Inc.
Alfred Neves, Teraspeed Consulting Group
Tom Dagostino, Teraspeed Consulting Group
Scott McMorrow, Teraspeed Consulting Group

2009 Presentation: Calibration and De-Embedding Techniques In the Frequency Domain

Al Neves, Teraspeed Consulting Group
Tom Dagostino, Teraspeed Consulting Group

DesignCon2009 Paper: Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR-4 Boards for 6-20 Gb/sec Applications

Yuriy Shlepnev, Simberian Inc.
Al Neves,Teraspeed Consulting Group
Tom Dagostino,Teraspeed Consulting Group
Scott McMorrow,

DesignCon2004 Paper: Identifying Sources of Jitter

Johnnie Hancock, Agilent Technologies

DesignCon2004 Paper:  A Hybrid Measurement and Electromagnetic Field Solver Approach for the Design of High-Performance Interconnects: An Investigation of Traces and SMA Transitions

Al Neves, Teraspeed Consulting Group
Scott McMorrow, Teraspeed Consulting Group