Dr. Eric Bogatin of the University of Colorado at Boulder and globally recognized expert in signal and power integrity in electronics, presents a webinar in partnership with Teledyne-LeCroy and Ansys, featuring best practices and measurement and simulation processes critical in designing high-speed serial data links.
The event will compare modeling and simulation results of a high-performance PCB and its multi-gigabit data links against actual lab test measurements. Join us in this technical webinar about high-speed PCB design and electromagnetic simulation.
Date: December 7, 2022
Time: 2 PM EST / 7 PM GMT
Location: Virtual/Online
Questions: Pete Gasperini
You can register Here
About the author : James Bell
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