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Yuriy Shlepnev

How to Design Predictable Interconnects up to 448 Gbps

2026-03-19T15:32:53-08:00

This presentation analyzes second-order design features using precision measurements of test vehicles and digital twins. We propose a metric-driven methodology based on AI/ML to determine relevant parameters for simulating anisotropic [...]

How to Design Predictable Interconnects up to 448 Gbps2026-03-19T15:32:53-08:00

How Interconnects Work: Crosstalk Quantification

2026-03-19T15:57:51-08:00

Crosstalk is unwanted noise from structures coupled to a signal link that degrade the useful signal and may reduce the data transmission rate and even cause complete link failure. All possible signal degradation effects, including the crosstalk, can be expressed with the balance of power.

How Interconnects Work: Crosstalk Quantification2026-03-19T15:57:51-08:00

Developing Unified Methods of 3D Electromagnetic Extraction, System Level Channel Modeling, and Robust Jitter Decomposition in Crosstalk Stressed 10Gbpsec Serial Data Systems

2026-03-19T16:28:05-08:00

As serial link speeds increase, systems become more “Stressed”. Loss, low probability deterministic jitter, crosstalk aggression from densely packed signal nets, via and connector impedance and associated resonances, and package [...]

Developing Unified Methods of 3D Electromagnetic Extraction, System Level Channel Modeling, and Robust Jitter Decomposition in Crosstalk Stressed 10Gbpsec Serial Data Systems2026-03-19T16:28:05-08:00

Practical identification of dispersive dielectric models with generalized modal S-parameters for analysis of interconnects in 6-100 Gb/s applications

2026-03-18T08:39:54-08:00

A novel method for extraction of dispersive dielectric parameters to 50 GHz is proposed. The method doesn’t require advanced de-embedding, and is based on correlation of measured and simulated generalized modal S-parameters of a line segment. First, VNA measurements for two line segments are made and used to compute generalized S-parameters of a difference segment. Second, 3D full-wave model of the difference segment with conductor model with roughness is used to identify the dielectric properties. We finalize the paper with the derivation of dielectric models for low-cost FR4-type and for expensive low-loss high-frequency materials. The advanced models can be used for practical electromagnetic analysis of interconnects for the 6-100 Gb/s realm.

Practical identification of dispersive dielectric models with generalized modal S-parameters for analysis of interconnects in 6-100 Gb/s applications2026-03-18T08:39:54-08:00
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