Crosstalk in PCB and packaging interconnects is unavoidable due to their open waveguiding nature, leading to signal energy leakage and exposure to noise from nearby and distant links via PDN structures. This tutorial aims to demystify crosstalk by explaining its mechanisms, quantification, and mitigation strategies. It details various crosstalk scenarios, visualized through power flow density derived from 3D EM analysis, and compares different quantification and mitigation techniques.

Technical Presentations