Achieving predictable behavior of PCB and packaging interconnects is essential for first-pass success, especially at 28-448 Gbps where design margins are tight. This tutorial introduces a comprehensive methodology to improve analysis-to-measurement correlation by addressing key challenges, such as material model accuracy, via localization, and manufacturing variations. Attendees will learn practical techniques to identify dielectric and conductor roughness models through S-parameter measurements and using GMS-parameters. A new waveguiding approach to via design and principles of low-sensitivity layout techniques are presented to improve predictability. Validation is demonstrated through the “sink or swim” process using benchmark platforms. The tutorial culminates in a multi-pass validation flow – from identifying localization issues to final 3D EM analysis – ensuring reliable compliance evaluation. Finally, we present a design flow tailored for real-world constraints. Attendees will leave with proven techniques to design interconnects that behave as intended, with insights into future trends.

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