This presentation explores key considerations and tradeoffs involved in achieving reliable simulation-to-measurement alignment, with examples spanning both time-domain and frequency-domain analysis.
The paper includes a study of the influence of anisotropy on the channel performance and examines methods to extract out the level of anisotropy. The overall goal is to achieve better than 2% measurement-simulation correlation in impedance profiles. This approach allows for optimized geometries and controlled geometry designs.
Reducing channel loss can enable lower power or longer unrepeated channel lengths.
In this presentation, Al Neves discusses the challenges of attaining good signal integrity beyond 50 GHz.
In the context of the IEEE P370 standard activities, the members collected data on how measurement results and de-embedding results can vary across different teams. In this paper, we present the analysis of the data collected.
We analyze the computational procedure specified for Channel Operation Margin (COM) and compare it to traditional statistical eye/BER analysis.
Practical calibration methods suited for 3D-EM, Verification and assurance, and Time domain processing and 3D-EM model development.
As serial link speeds increase, systems become more “Stressed”. Loss, low probability deterministic jitter, crosstalk aggression from densely packed signal nets, via and connector impedance and associated resonances, and package [...]
A novel method for extraction of dispersive dielectric parameters to 50 GHz is proposed. The method doesn’t require advanced de-embedding, and is based on correlation of measured and simulated generalized modal S-parameters of a line segment. First, VNA measurements for two line segments are made and used to compute generalized S-parameters of a difference segment. Second, 3D full-wave model of the difference segment with conductor model with roughness is used to identify the dielectric properties. We finalize the paper with the derivation of dielectric models for low-cost FR4-type and for expensive low-loss high-frequency materials. The advanced models can be used for practical electromagnetic analysis of interconnects for the 6-100 Gb/s realm.
A new and inherently passive and causal time-domain oriented approach for 3D Electromagnetic modeling is introduced in detail.
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