In this presentation, we demonstrate new de-embedding techniques integrated into VNA firmware that make frequency-domain signal integrity measurements easier, more accurate, and less error-prone. We also present new tools to predict system response to arbitrary time domain signals.
This presentation will discuss advances in Electronics simulation techniques including FEM and Transient Electromagnetic Simulation techniques; Automated Connector/Board Assembly Meshing/Analysis; Electromagnetics Based EMI/EMC Analysis; Crosstalk/Impedance Scanning; Integrated Electronics/Thermal Analysis (Multiphysics); High-Performance Computing; 3D Components, etc.
In the context of the IEEE P370 standard activities, the members collected data on how measurement results and de-embedding results can vary across different teams. In this paper, we present the analysis of the data collected.
In this paper, a practical method to model effective permittivity and phase delay, due to conductor surface roughness, is presented.
In this paper, a practical method to model effective permittivity and phase delay, due to conductor surface roughness, is presented.
We analyze the computational procedure specified for Channel Operation Margin (COM) and compare it to traditional statistical eye/BER analysis.
We analyze the computational procedure specified for Channel Operation Margin (COM) and compare it to traditional statistical eye/BER analysis
Practical calibration methods suited for 3D-EM, Verification and assurance, and Time domain processing and 3D-EM model development.
This paper addresses a new methodology for 12 Gbps interoperability that combines a concerted family of pathological channels, internal eye monitoring, and external EQ simulation tools, providing insight into an EQ optimization strategy that addresses the specific channel’s mix of crosstalk noise, jitter, and channel loss.
As serial link speeds increase, systems become more “Stressed”. Loss, low probability deterministic jitter, crosstalk aggression from densely packed signal nets, via and connector impedance and associated resonances, and package [...]
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