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James Bell
2026-03-18T07:49:17-08:00
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13th Central PA Signal Integrity Symposium
3D
3D Electromagnetic Modeling
3D EM
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anisotropic materials
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Document Author
Al Neves
Alan Blankman
Alex Manukovsky
Alexander Kuntsevych
Alfred Neves
Alfred P. Neves
Bert Simonovich
Bill McGinn
Bob Buxton
Ching-Chao Huang
Chuck Ferry
Cristian Filip
Eric Bogatin
Frank Zavosh
George Noh
Greg Bonaguide
Heidi Barnes
Itzhak Peleg
James Bell
Jason Ellison
Jim Nadolny
John Phillips
John Smith
Jon Martens
José Moreira
Joshua Nutzati
Josiah Bartlett
Kristoffer Skytte
Lambert (Bert) Simonovich
Martin Miller
Martin Schauer
Martin Spadaro
Michael Steinberger
Mikheil Tsiklauri
Patrick Murray
Scott McMorrow
Shimon Mordooch
Tom Dagostino
Vladimir Dmitriev-Zdorov
Yuriy Shlepnev
Search:
+50GHz, 56-112G PAM-4, Thoughts and Opinions For Designing Stellar S.I. Test Fixtures
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Advances in VNA-based Signal Integrity Tools and Techniques
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AI-Focused Success Vectors for Achieving Strong Simulation-to-Measurement Correlation
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BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?
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BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?
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Calibration and De-Embedding Techniques in the Frequency Domain
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Developing Unified Methods of 3D Electromagnetic Extraction, System Level Channel Modeling, and Robust Jitter Decomposition in Crosstalk Stressed 10Gbpsec Serial Data Systems
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Electromagnetic Simulation Techniques for High Speed Connectors and PCBs
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Evaluation of S Parameters Similarity with Modified Hausdorff Distance
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Exploration of Deterministic Jitter Distributions
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Free signal integrity? How understanding anisotropic materials and tolerances could increase performance at 112/224Gbps and beyond
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Free signal integrity? How understanding anisotropic materials and tolerances could increase performance at 112/224Gbps and beyond
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Full-wave time domain modeling of interconnects
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high speed coms white paper wild river samtec esilicon 20190705
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How Interconnects Work: Crosstalk Anatomy and Quantification
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How Interconnects Work: Crosstalk Quantification
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How to Design Predictable Interconnects up to 448 Gbps
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Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR-4 boards for 6-20 Gb/sec Applications
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Methods of Improving 3D EM Model Development and Associated Time/Frequency Domain Measurements
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PAM4 Transmitter Test Challenges
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Practical identification of dispersive dielectric models with generalized modal S-parameters for analysis of interconnects in 6-100 Gb/s applications
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Practical Method Model Effective Permittivity and Phase Delay Due to Conductor Surface Roughness white paper 20170128
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Robust Method for Addressing 12 Gbps Interoperability for High-Loss and Crosstalk-Aggressed Channels
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S-Parameter Measurement and Fixture De-Embedding Variation Across Multiple Teams, Equipment and De-Embedding Tools
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Via Design for 112 Gbps and Beyond: Theory and Reality
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